DLD High-hardness Thermal-conductive Waterproof High-temperature-resistant High-viscosity Two-component AB Epoxy Potting Compound for Power Module Electronics

Item No.: 00140
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$4.00
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1 Kilogram(Min. Order)
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(99999 In Stock)
Description
Description
Electronic potting adhesives provide excellent protection, forming a dense seal to shield electronic components from moisture, dust, and mechanical impact, thus ensuring stable operation. They have high electrical insulation to prevent short circuits and enhance the safety of electronic devices. With good thermal conductivity, some varieties can help dissipate heat, avoiding overheating of components. Additionally, they exhibit strong adhesion to materials like metals, plastics, and ceramics, keeping internal parts securely in place. These adhesives are widely used in the encapsulation of circuit boards, sensors, transformers, and LED modules, as well as in automotive electronics, industrial control systems, and consumer electronics, effectively extending the service life of electronic products in various environments.
Primary curing 8-10h Impact Strength 8.5kg/m
Thermal Conductivity 1.0 Dielectric Constan 3.75(1KHz)
Temperature Resistance -30~120℃ Hardness ≥85Shore D
Heat Curing 1.5h Flexural Strength 11kg/m
Tensile Strength 16.5kg/m


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