

| Working Time | 35~60min | Shrinkage Rate | 0.3% |
| Initial Curing | 3-8h | Thermal Conductivity | 0.3W/(m*k) |
| Curing Time | Heat up to 120°C for 1 to 1.5 hours | Dielectric Strength | ≥25KV/mm |
| Complete Curing | 24h | Dielectric Constant | 2.9(1.2MHz) |
| Mixing Viscosity | 2000-3000cps | Waterproof Rating | IP68 |
| Hardness | 20-30 Shore D |





